Aligner
- Wafer Pre Aligner(ACE-XV Series)
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Key Features
- Fast alignment
- High performance accuracy
- High performance repeatability
- Easy to use and install
Model
- ACE-XV-300N, ACE-XV-300NS
- ACE-XV-200N, ACE-XV-200NS
- ACE-XV-150N
Option
- Sapphire Command select
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ITEM SPECIFICATION Wafer type Ø300, Ø200, Ø150, Ø100, Si, Notch,Flat, (Option : Sapphire) Θ rotation 0.0072 º Axis ϴ , X, Y Stage repeatability ± < 3um Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 30um Positioning time < 3.5 sec Interface RS-232, Digital I/O Utility Vacuum Power +24VDC / 5A
- Wafer Pre Aligner(ACE-PL Series)
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Key Features
- High performance and repeatability
- Soft touch pad
- Edge contact
- No back side contamination
- Easy to use and install
Model
- ACE-PL-200N
- ACE-PL-300N
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ITEM SPECIFICATION Wafer type Ø300, Ø200, Ø150, Ø100, Si – Notch Wafer Θ rotation 0.0072 º Axis ϴ , Z Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 30um Positioning time < 0.7 sec Lift time < 0.5 sec down,< 1.0 sec up Interface RS-232, Digital I/O Utility Air Power +24VDC / 5A
- Wafer Pre Aligner(ACE-VP Series - Vacuum Aligner)
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Key Features
- High performance and repeatability
- Use vacuum chamber
- Easy to use and install
Model
- ACE-VP-300A. ACE-VP-300B
- ACE-VP-200A. ACE-VP-200B
- ACE-VP-150A. ACE-VP-150B
Option
- Sapphire Command select
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ITEM SPECIFICATION Wafer type Ø300, Ø200, Ø150, Si, Glass, Sapphire Select Θ rotation 0.0072 º Axis ϴ Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 50um Positioning time < 0.6 sec Interface RS-232, Digital I/O Utility unnecessary Dimension (Controller) 150(W) * 65(L) * 180(H) Power +24VDC / 5A
- Wafer Pre Aligner(ACE-S Series)
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Key Features
- Include OCR
- Wafer all size alignment
- Special Type
- Include OCR
Model
- ACE-XV-300N-15R
- ACE-XV-300N-15L
- ACE-XV-200N-15F
Option
- Wafer edge burr, chipping
- Sapphire Command select
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ITEM SPECIFICATION Wafer type Ø300 Notch, Ø200 Notch Flat, Θ rotation 0.0072 º Axis ϴ , X, Y Stage repeatability ± < 3um Notch alignment accuracy ± < 0.1 º Positioning time < 3.5 sec Interface RS-232, Digital I/O Utility Vacuum Power +24VDC / 5A
- Wafer Pre Aligner(ACE-G Series)
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Key Features
- High performance repeatability
- Easy to use and install
- Wafer edge contact
- Grip alignment
Model
- ACE-XG-300N
- ACE-XG-200N
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ITEM SPECIFICATION Wafer type Ø300, Ø200, Si-Wafer Notch type Θ rotation 0.0072 º Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 50um Positioning time < 3.5 sec Interface RS-232, Digital I/O Utility Air Power +24VDC / 5A
- Wafer Pre Aligner(ACE-R Series)
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Key Features
- Thin Wafer alignment
- Ring wafer alignment
- High performance repeatability
- Easy to use and install
Model
- ACE-XR-200L
- ACE-XR-300L
- ACE-XRF-300L
- ACE-XRW-300L
Option
- Sapphire Command select
- Ring Flat, Flat Wafer, Warpage
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ITEM SPECIFICATION Θ rotation 0.0072 º Axis Θ Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 50um Positioning time < 3.5 sec ~ 5.5sec Interface RS-232, Digital I/O Utility Vacuum. Air Power +24VDC / 5A
- Wafer Pre Aligner(ACE-W Series)
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Key Features
- Wafer alignment
- WEE function
- High performance repeatability
- Easy to use and install
Model
- ACE-W-300N
- ACE-W-200N
- ACE-W-320N
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ITEM SPECIFICATION Wafer Type Ø300, Ø200, SI- Wafer Function Wafer alignment and edge exposure Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 30um Exposure Width 0.1mm ~ 8.0mm Interface RS-232, Digital I/O Utility Vacuum. Air Power +24VDC / 5A
- Wafer Pre Aligner(ACE-W Series)
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Key Features
- Wafer alignment
- Warpage, Bonding wafer align
- Special Ceramic wafer
- High performance repeatability
- Easy to use and install
Model
- ACE-XW300N
- ACE-XWF300N
Option
- Sapphire Command select
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ITEM SPECIFICATION Wafer Type Si-Notch, 296mm Si-Flat , Warpage , Glass, Sapphire Θ rotation 0.0072 º Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 50um Positioning time ± < 4.5 sec Interface RS-232, Digital I/O Utility None Power +24VDC / 5A
- MASK Aligner(ACE-MASK150Q)
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Key Features
- Fast alignment
- High performance accuracy
- High performance repeatability
- Easy to use and install
Model
- ACE-MASK150Q,
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ITEM SPECIFICATION Wafer Type 150mm * 150mm Square Glass Mask Θ rotation 0.0036 º Axis Center, Theta, Rotation Wafer detect Glass sensor Notch alignment accuracy ± < 0.05 º Centering accuracy ± < 30um Positioning time 0°< 3.0sec , 90°< 4.0sec, 180°< 5.0sec, 270°< 5.0sec Chuck ORG time 0°=0sec , 90°< 1.5sec, 180°< 2.0sec, 270°< 2.5sec Interface RS-232, Digital I/O Utility Vacuum, Air (DRY 5.0kg) Weight 6Kg Power +24VDC / 5A
- Wafer Pre Aligner(ACE-DXV Series)
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Key Features
- Fast alignment
- High performance accuracy
- High performance repeatability
- Easy to use and install
Model
- ACE-DXV320N-(A)(R)(L)
- ACE-DXV215N–(A)(R)(L)
- ACE-DXV200L
- ACE-XV300L
- ACE-XV200L
Option
- Sapphire Command select , OCR Type
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ITEM SPECIFICATION Wafer Type Ø300~ Ø200 , Ø200~ Ø150, Ø150~ Ø100, Notch, Flat, Si,Glass, Sapphire Θ rotation 0.0072 º Axis ϴ , X, Y Chuck size Ø50 Stage repeatability ± < 3um Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 30um Positioning time < 3.5 sec, < 4.5 sec Interface RS-232, Digital I/O Utility Vacuum Power +24VDC / 5A
- Wafer Pre Aligner(ACE-QXV34-215L)
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Key Features
- Fast alignment
- High performance accuracy
- High performance repeatability
- Easy to use and install
Model
- ACE-QXV34-3215N-(A)(R)(L)
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ITEM SPECIFICATION Wafer Type Ø340~ Ø300~ Ø200~Ø150 Notch, Flat, Si Wafer Θ rotation 0.0072 º Axis ϴ , X, Y Chuck size Ø50 Stage repeatability ± < 3um Notch alignment accuracy ± < 0.1 º Centering accuracy ± < 30um Positioning time < 3.5 sec(340mm), < 4.5 sec(300mm) , < 4.8sec(200mm), < 5.1sec(150mm) Interface RS-232, Digital I/O Lifter UP / DN UP time 1.0sec DN time 1.0sec Utility Vacuum Power +24VDC / 5A
- FLIP Aligner(ACE-FLIP-150Q)
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Key Features
- Fast alignment
- High performance accuracy
- High performance repeatability
- Easy to use and install
Model
- ACE-FLIP-150Q
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ITEM SPECIFICATION Wafer Type 150mm * 150mm Square Glass Mask Θ rotation 0.0036 º Axis Flip Wafer detect Glass sensor Flip accuracy ± < 0.05 º Positioning time(Flip) < 3.0sec Chuck ORG time < 1.5sec Interface RS-232, Digital I/O Utility Air (DRY 5.0kg) Weight 5Kg Power +24VDC / 3A
- BATCH Aligner(ACE-BATCH-200F)
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Key Features
- Fast alignment
- High performance accuracy
- High performance repeatability
- Easy to use and install
Model
- ACE-BATCH-200F
Option
- Sapphire Command select
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ITEM SPECIFICATION Wafer Type Ø200mm Si-Flat Θ rotation 0.0032 º Axis Roller, Guide Operation mode 2 Type operation alignment accuracy ± < 0.1 º Positioning time(Flip) SORT°< 5.0sec, BOT°< 7.0sec, TOP°< 13.0sec Interface RS-232, Digital I/O Weight 5kg Power +24VDC / 3A
- DESK COATER(GMS Series)
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Key Features
- Desk Coater
- Full Color Touch screen
- 20Step 20Recipe
- Easy to use and install
- Center jig
Model
- ACE-GMS-100
- ACE-GMS-200
- ACE-GMS-300
- ACE-GMS-300-10000R
- ACE-GMS-250SQ
Option
- Special
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ITEM SPECIFICATION Model (Wafer) GMS-100(2~6”), GMS-200(2~8”), GMS-300(2~12”) GMS-SQ(250 * 250* * 8 Square Mask Wafer), Motor AC Servo Spin RPM 3000RPM (MAX 5000RPM) Dispense Manual Dispense CUP SUS Chuck Vacuum Type Control Touch Color Screen Recipe 20Step 20Recipe, Fill color Touch screen Weight 5kg, 60kg, 70kg, Power AC 100~220V 1Ø
- DESK BAKE UNIT
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Key Features
- Desk Type
Model
- ACE-HOT-100,200,300
Option
- Special
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ITEM SPECIFICATION Model (Wafer) 4”, 6, ”, 8”, 12” ACE-HOT-100,200,300 Max Working Temp 200ºC Operating Temp 50ºC ~ 150ºC Timer 1~9999 sec Temp Uniformity 1ºC at 150ºC Electric wattage 1kW Control PID Control Chamber exhaust Exhaust line 3/8” Dry Air 3~5kg Power AC 100~220V 1Ø
- SPIN DEV BAKE UNIT
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Key Features
- Manual Type
Model
- ACE-SDB-100,200,300
Option
- Special
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ITEM SPECIFICATION Model (Wafer) 4”, 6, ”, 8”, 12” COATER + DEVELOPER + HP Max Working Temp 200ºC Operating Temp 50ºC ~ 150ºC Timer 1~9999 sec Temp Uniformity 1ºC at 150ºC Loading Manual Control PID Control, Pin UP/DN Spin RPM 3000RPM (MAX 5000RPM) Dry Air 3~5kg Power AC 100~220V 1Ø